Sika Werke GmbH produces copper- laminated flexible base material with various carrier foils for the manufacture of printed circuits, flat cables, membrane keyboards, aerials and impedance foils to customer specifications.

Currently, the following material combinations are possible:

Cu: 18µm / 35µm / 75µm ED-Cu
PET: 23µm / 36µm / 50µm / 75µm / 100µm (also low shrinkage)
PEN: 25µm / 50µm / 75µm
PI: 25µm / 50µm / 75µm